专利名称：ENCAPSULATED DEVICES AND METHOD OF
MAKING
发明人：MORO, Lorenza,KRAJEWSKI, Todd, A.申请号：EP06802335.7申请日：20060825公开号：EP1925043A1公开日：20080528
摘要：A method of encapsulating an environmentally sensitive device. The methodincludes providing a substrate; placing at least one environmentally sensitive deviceadjacent to the substrate; and depositing at least one barrier stack adjacent to theenvironmentally sensitive device, the at least one barrier stack comprising at least onebarrier layer and at least one polymeric decoupling layer, wherein the at least onepolymeric decoupling layer is made from at least one polymer precursor, and whereinthe polymeric decoupling layer has at least one of: a reduced number of polar regions; ahigh packing density; a reduced number of regions that have bond energies weaker thana C-C covalent bond; a reduced number of ester moieties; increased Mw of the at leastone polymer precursor; increased chain length of the at least one polymer precursor; orreduced conversion of C=C bonds. An encapsulated environmentally sensitive device isalso described.
申请人：Vitex Systems Inc.
地址：3047 Orchard Parkway San Jose, CA 95134 US
国籍：US
代理机构：Cummings, Sean Patrick
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